Signal integrity Analysis
We provide comprehensive system level SI/PI simulation services at package & PCB level and can resolve any kind of complex SI issue, PI issue for any problem related with s-parameters in the post-layout design.
- High speed serial/parallel interface analysis and design guidelines (DDR3, DDR4, multi-gigabit Serdes, PCIe gen3 & gen4, XAUI, HDMI, SATA, USB, Flash, chip-to-chip IO, FPGA IO)
- Signal integrity & power integrity co-design SSN modelling
- pre-layout & post-layout SI analysis.
- IBIS/IBIS-AMI based system level SI evaluation.
- Routing studies, termination schemes, stackup design & analysis.
- Trace & Via design for controlled impedance using EM solver.
- Full-wave EM modelling of all kinds of interconnects (via, connector, end-to-end channel)
- Crosstalk and s-parameter modelling of traces and interconnects on package and board.
- Connector design modelling and simulation.
- IBIS model generation
Power integrity Analysis:
- Analyze and verify power supply quality at chip, package & board level.
- Target impedance estimation and optimization.
- Decoupling cap estimation and optimization
- Power-ground loop inductance & stackup optimization.
- S-parameter & parasitic extraction (R,L,C)
- IR drop analysis and give recommendation about placement of components.
- Time-domain power integrity noise estimation.
EMI/EMC Analysis:
- Board level & System level EMI/EMC Analysis.
- RE Analysis – Near field and Far field analysis
- RE and CE Analysis with Shield case
- Conduction noise (CE) analysis and modelling for Power lines
- Frequency V/S dB plot for Different standards
(FCC, CISPR, VCCI or User specific) - Electromagnetic susceptibility analysis
- 3D Magnetic/Electric & Current density Plot
- Filter design
ESD Analysis:
- Board level & System level ESD Analysis.
- ESD Circuit modelling and ESD GUN Model
- Air Charge ESD Simulation
- ESD Path analysis with 3D Simulation tools.
Thermal analysis:
- PCB and System level thermal analysis
- Joule heating effect analysis including power loss information on traces
- Heat sink and cooling proposals
- Metal core and thermal ladder PCB designs
- Major heat transfer mechanisms analysis viz., Conduction, Convection,
Radiation
Detailed reports indicating component and board temperature profiles
